In-Circuit Test Systems | Multi-Core ICT for PCB Production

Flexible, High-Coverage In-Circuit Test in One Station

CheckSum ICT Delivers Fast Electrical Verification Across Panelized Boards Using Multi-Core In-Circuit Test Architecture. Multiple ICT Cores Operate Simultaneously to Keep Pace with Modern SMT Production, While Maintaining Comprehensive Component-Level Test Coverage.

Key Points:

Scalable Throughput with Single, Dual, or Quad ICT Cores
Parallel Testing of Multiple Boards When Production Volume Requires it
Integrated ICT, Programming, and Functional Verification within One Architecture

Modular Multi-Core In-Circuit Test Architecture

CheckSum ICT Delivers Fast Electrical Verification Across Panelized Boards Using Multi-Core In-Circuit Test Architecture.

Systems Can be Configured with One, Two, or Four ICT Cores, Allowing Manufacturers to Scale Electrical Verification Capacity While Maintaining Consistent Test Coverage.

Comprehensive Component-Level Verification
- Resistance, Capacitance, and Inductance Measurement
- Diodes and LEDs
- Bipolar Transistors, MOSFETs, SCRs, and TRIACs
- Opto-Couplers and Transformers
- Relays, Shorts, and Opens Detection
- TestJet™ Vectorless Test Technology

Power-On and Functional Verification
CheckSum Supports Full Powered-On In-Circuit Verification Using the Same Electrical Access Established Through the ICT Fixture.

Typical Capabilities Include:
- Voltage and Current Measurements
- Frequency and Timing measurements
- AC and DC stimulus
- Digital Signal Verification
- Communication Bus Testing Such as CAN, I²C, LIN, and SPI
These capabilities allow manufacturers to validate circuit behavior immediately after component-level verification.

Advanced Test Integration
CheckSum ICT Platforms Support Integration of Additional Test Capabilities Within the Same Production Architecture.

Capabilities Include:
- MultiWriter™ In-System Programming Integration
- Boundary Scan Integration
- Built-In Self-Test Verification
- Fixture-Level Parallel Functional Test (PFT) Resources
This Flexible Architecture Allows CheckSum ICT to Serve as the Electrical Foundation for Broader Production Test Strategies, Including CheckSum’s Parallel Functional Test (PFT). These Tools Support Many Verification Tasks Traditionally Performed at End-of-Line Testing, Allowing Manufacturers to Increase Test Coverage Earlier in the Production Process.

Trusted Across High-Volume

Electronics Manufacturing

CheckSum ICT is Used in Demanding Production Environments Where Speed, Reliability, and Measurement Accuracy are Essential.

Markets Served: Automotive Electronics, Industrial Electronics, Medical Electronics, Consumer Electronics, Flexible Circuits, and Semiconductor Package Testing.

Manufacturers Choose CheckSum ICT for Reliable Hardware, Strong Measurement Capability, Scalable Test Speed, and Software that Helps Control the Production Test Process.

Engineered for High-Volume

Production Performance

CheckSum ICT is Built on Production-Proven Architecture Refined Through Years of Real Factory Use. It is Designed for the Practical Demands of Electronics Manufacturing, Delivering Repeatable Test Performance, Scalable Throughput, and Dependable Operation in Environments Where Uptime, Coverage, and Process Consistency Matter.

4,000+ CheckSum Systems Deployed Worldwide
Billions of PCBs Tested in Production Environments
Proven in High-Volume manufacturing Where Reliability and Uptime Matter.
Scalable Architecture that Supports Growing Throughput Demands Without Changing Platforms

Multi-Core: 1 / 2 / 4 boards in parallel per cycle.
High-speed: solid-state relays for fastest execution.
Full coverage: analog + digital + powered-on (advanced tests).

Faster test drives more value, enabling ISP + PFT in one test cell.

High-speed ISP: programs at the speed of the device.
Easy-to-use software: job integrity, process control, and reporting.
Security: encryption + serialization for advanced cybersecurity.

Turnkey and production-ready--engineered to integrate seamlessly with ICT + PFT in one test cell.

Parallel panel-level FT: test the entire panel in parallel — 5–10× faster.
Project-by-project: designed to your unique application and test spec.
Scalable + modular: seamless integration with CheckSum’s test software.

High-speed panel-level functional testing enables more coverage early, reducing EOL load and scrap risk.

Dual-panel automation: high-speed, fully automated test handling with two stop positions.
Dual-panel flexibility: run single, dual-panel parallel, or dual-panel sequential test flows.
One platform for Parallel Test: supports CheckSum’s ICT + MultiWriter + PFT.

Unique dual-panel handling doubles throughput, dramatically reducing total cost of test while enabling enhanced test coverage earlier in the process.